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Himflex 3

Chemical resistant caulking compound, two-part, modified epoxy composition

TS 5772-005-74321702-2012

Original state: ingredients A – thick thixotropic paste, Ingredients B - low-viscosity clear liquid
Suitable for food processing premises
High mechanical strength
Minimal shrinkage
High acid resistance

Technical characteristics

Ingredients A density
1,75 kg/l
Ingredients B density
1,05 kg/l
Mixture viability at 20°С
60 min
Surface is ready to use for pedestrian load at 20°С
in 1 day
Surface is ready to use for full mechanical and chemical load at 20°С
in 7 days
Ultimate compressive strength, not less than
>50 MPa
Ultimate tensile strength, not less than
>30 MPa
Fluidity resistance, not more than
2 mm
Acid resistance (H2SO4 20%)
98 %
Alkali resistance (NaOH 20%)
98 %
Water absorption 0,3%
Shelf life in fabrically closed packaging
12 months
Application in the food processing premises
Increased strength
Shore hardness D
82 s.u.
Mixing proportions (А : B), parties by weight
9 : 1
Application temperature, ºС
from 12° to 30°
Operating temperature, ºС
from -30° to 120°


Caulking compound Himflex 3 is designed for fitting the tiles and decorative framing of joints while making anticorrosive protection with single-piece articles (tile, brick, shaped graphite products and etc.), for facing the surfaces of building structures and buildings and making lining for technological equipment. It can also be used as filler for a wide range of surfaces. Application in food industry premises is possible (without direct contact with food).

In comparison to Himflex 2K it has increased temperature resistance up to + 120º С and good chemical resistance


Modified epoxy composition, finely dispersed chemical resistant filler, special additives and amine-type mixture hardener.




Foundation shall be thoroughly cleaned from dust, moving particles, scales, fat and oil stains. It must have mechanical strength and have sufficient bearing capacity. Residual moisture of the substrate to the depth of 20 mm can not exceed 10 %. For binding free water on the surface preliminary priming is required. For these purposes the following our products are suitable: Himflex Primer EP 01 (base – epoxy resin emulsion) that can be applied to wet and dry substrates or Himflex Primer EP 02 (modified epoxy composition), that can be applied to concrete substrates with residual moisture up to 10 %.


Cleaned surface shall be preliminary primed with appropriate bottoms on epoxy base. Welds shall be released from welding slag (flux) and layers of scale. Remove notches, burrs, welding spatters by grinding, round sharp edges, corners, notches, welding seams. Grease, marking paint or other substances shall be removed from the surface. If needed, before performing blasting, to remove organic contaminants a solvent can be used (white spirit in accordance to GOST 3134). Degreasing shall be made to level 1 (GOST 9.402). Metal surface of protected constructions must be cleaned to the degree of purification Sa 2,5 (ISO 8501-1) or to level 2 (GOST 9.402).


Joints shall be dried and cleaned from dust and glue residue before caulking compound application. They must have rectangular cross section, width from 5 up to 10 mm and depth not less than 15 mm (for tiles with thickness from 20 mm and more).


CAULKING COMPOUND PREPARATION                                                                                       

Caulking compound preparation is done by thoroughly components mixing on the worksite. For doing this it is essential to open the bucket 0,4 kg with ingredients B (viscous liquid) and pour it into the bucket 4,6 kg with ingredients A (viscous paste). These ingredients can be mixed directly into the bucket at a specified proportion with a mechanical mixer or low-speed (300-400 rpm) electric drill equipped with a special mixing head for 2 minutes to form a homogeneous mixture without stripes and lumps. Special attention shall be paid to mixing the caulking compound near the walls and bottom of the bucket.



For tile fitting

Ready to use caulking compound is applied to the laying area (primed if needed) with a serrated spatula. This area shall be faced with tiles for 20-30 minutes. Thickness of the layer beneath the tile can not exceed 2…3 mm and serration dimension of the spatula are chosen depending on the standard size of the tile. For acid resistant tile with big dimensions (with thickness from 20 mm) and in places undergoing severe intensive mechanical loads layer thickness shall be not less than 2…3 mm and tile joints filling depth can not be less than 1/3 of  tile thickness. Tile shall be laid on adhesion layer and pressed, providing necessary contact with tiled surface. If caulking compound gets on the face of the tile it should be immediately removed with damp sponge. In case of cleaning delay (after 40 minutes) stripes and stains can be cleaned with 10 % solution of spirit or solvents: acetone, toluene.

For decorative framing of joints

Caulking compound is applied with special spatula made from hard rubber or flexible metal spatula. For complex surfaces (with porous structure and roughness) it is recommended to cover tile surface along the joint contour with masking tape or any other identical material (e.g. paper tape) or to treat tile along the joint contour with wax before caulking compound application.



After Himflex 3 caulking compound application tile surface is immediately cleaned with a damp sponge or with composition Himflex-Cleaner. In case of cleaning delay (after 60 minutes) tile surface can be cleaned with 10 % solution of spirit or solvents: acetone, toluene. If caulking compound has already hardened (after 5-6 hours) tile surface cleaning can be extremely difficult and could only be done by mechanical means



Metal surfaces shall be preliminary primed with appropriate bottoms on epoxy base. Ready to use caulking compound is applied to the prepared surface with a spatula or stainless steel gauging trowel. Application temperature not lower than +5° С. Caulking compound hardening time depends on air temperature. Operation time and technological properties of the caulking compound depend directly on ambient air temperature. It is important to take into consideration that the temperature of facing materials and surfaces could be extremely different from the temperature in the premise. Recommended caulking compound application temperature is in the range from +12º С up to + 25º С. Optimal working temperature for epoxy compositions is in the range of 20º ± 2º С. In this conditions caulking compound has optimal viscosity and its viability is approximately 40 minutes.



Tile dimension




 Tile thickness, mm








 Consumption, kg/m2











  • Not recommended for construction joints filling;
  • Clean tile surface before the composition hardened (see Application unit);
  • Do not expose caulking compound Himflex 3 to solvents earlier than in 1-2 weeks after application (depending on air temperature in the premises where works are carried out).



  • Wear protective gloves and glasses while working with composition;
  • If skin contact occurs, the area should be immediately and thoroughly washed with water;
  • If exposed to eyes, eyes should be immediately and thoroughly flushed with water and seek medical attention immediately.



  • Caulking compound components (Ingredients A and B) shall be stored in sealed containers in covered storage rooms (in unheated is also possible);
  • In case of caulking compound transportation and storage at the temperature lower than 0º С, unpacking of containers shall be made not earlier than in 24 hours after their conditioning at the temperature of 25º ± 5º С.


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